Shantonu
Biswas
Inventor of Metamorphic Electronics. Pioneer of RDL-based flexible backplane technology for next-generation wearables. Ph.D. in Nanotechnology, summa cum laude.
Who I Am
I am a Research Scientist and Technical Lead at Meta Reality Labs, where I pioneer next-generation wearable hardware technologies. My work sits at the intersection of materials science, advanced semiconductor packaging, and human-machine interfaces — a rare combination that bridges fundamental discovery and high-volume manufacturing.
I am the inventor of Metamorphic Electronics — a field I founded that explores shape-adaptive, deformable electronic systems for consumer electronics, health monitoring, soft robotics, and haptics. My research has been published in Nature Communications, Advanced Materials, and Proceedings of the IEEE, among others.
At Meta, I drove a novel RDL-based flexible backplane technology from a lab-based proof-of-concept through NTI to high-volume production readiness — a lab-to-fab execution journey that defines my unique value as both an inventor and an engineer.
Career Journey
Specialized Research Scientist
- ▸Invented and pioneered a novel RDL-based flexible backplane technology that serves as a critical enabler for next-generation wearable displays and haptic devices
- ▸Drove full technology ownership from early-stage lab concept through foundry-based NTI and toward high-volume manufacturing — a complete lab-to-fab execution
- ▸Delivered significant improvements in routing density, device thickness, yield, and mechanical reliability through systematic process development and foundry collaboration
- ▸Managed multi-program technology development budgets and led cross-functional teams spanning materials science, process engineering, and product integration
- ▸Established and managed strategic foundry and OSAT partnerships for advanced packaging technology transfer and scale-up
- ▸Contributed to wafer-level packaging, flip-chip integration, and SiP module development for AR/VR and wearable hardware programs
- ▸Recognized as a technical authority and internal champion for flexible backplane integration within Meta's wearable hardware ecosystem
Research Areas
RDL-Based Flexible Backplane Technology
Pioneered a novel approach to wearable display and haptic backplanes using redistribution layer (RDL) technology on flexible substrates. This work enables ultra-thin, high-density interconnect systems that conform to curved surfaces — a critical enabler for next-generation AR/VR and smart wearable devices.
Publications & Patents
View on Google ScholarIntegrated Soft Optoelectronics for Wearable Health Monitoring
A Multimodal, Enveloping Soft Gripper: Shape Conformation, Bioinspired Adhesion, and Expansion-Driven Suction
Integrated Multilayer Stretchable Printed Circuit Boards Paving the Way for Deformable Active Matrix
Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points
Metamorphic Stretchable Touchpad
Emerging Material Technologies for Haptics
Core–Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects
Stress-Adaptive Meander Track for Stretchable Electronics
Localized Collection of Airborne Biological Hazards for Environmental Monitoring
3D Metamorphic Stretchable Microphone Arrays
Metamorphic Hemispherical Microphone Array for Three-Dimensional Acoustics
Deformable Printed Circuit Boards that Enable Metamorphic Electronics
Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries
Approaching Roll-to-Roll Fluidic Self-Assembly: Relevant Parameters, Machine Design, and Applications
Millimeter Thin and Rubber-Like Solid-State Lighting Modules Fabricated Using Roll-to-Roll Fluidic Self-Assembly and Lamination
Automated Reel-to-Reel Fluidic Self-Assembly for the Production of Solid State Lighting Modules
Self-Assembly: A First Implementation of an Automated Reel-to-Reel Fluidic Self-Assembly Machine
A First Implementation of an Automated Reel-to-Reel Fluidic Self-Assembly Machine
Patents
Flexible Electronic System for Flexible Wearable Devices and Other Electronic Devices
Stretchable Electronic Device and Method of Making the Same
The Whole Person
Science is what I do. Family, curiosity, and adventure are who I am.
Family First
Married to Ranita R. Paul, and proud father of Neevan (born 2019) and Rishan (born 2022). Family adventures — from Green Lake walks to Skyzone flips — are the heart of life outside the lab.
Travel & Exploration
A lifelong traveler who has lived on three continents across Asia, Europe, and North America. Drawn to places rich in history and natural beauty — from ancient civilizations to remote landscapes.
Photography
Capturing the world through a lens — from the vibrant energy of city nights to quiet moments in nature. Photography is how I preserve the stories that matter.
Nature & Adventure
Whether hiking Pacific Northwest trails, exploring national parks, or simply watching the Pacific sunset, nature is where I recharge and find clarity.
Ancient Civilizations
Fascinated by the ingenuity of ancient peoples — from the engineering of the pyramids to the philosophy of ancient Greece. History is the longest experiment in human innovation.
Continuous Learning
A firm believer that growth never stops. From staying current with semiconductor industry trends to exploring new ideas in AI, curiosity is the engine of progress.
"I believe in taking bold steps in life, embracing new opportunities, and building a future centered around both personal fulfillment and family."
Let's Connect
Open to research collaborations, speaking opportunities, advisory roles, and conversations about the future of advanced packaging and wearable technology.
Senior Technical Leadership Roles
Actively exploring Director-level and Principal Scientist positions in advanced packaging, foundry technology development, and wearable hardware at leading semiconductor and consumer electronics companies.